Egzoset's 2.5-D Versatile IH WorkCoil(s) Assembly for LAVACapsule concept - Still 4 Turns per U-Core *if* AWG#16 substitute
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Litz wire prefered:
AWG#16 = 1.29 mm (dia.), 50~100 KHz
E.G. exactly 1.29032 mm diameter...
Estimated minimal PCBoard size:
6.7 cm x 6.4 cm
As thin as 1 cm if all U-cores have their central external corners cut to accomodate juxtaposed Coil units, e.g. if that's all intended to fit into only 1 same plane, hence implicitely sacrificing some benefits as a "trade-off", naturally...
In particular i was most optimistic that a 3rd axis presumed assimilable to some "pseudo-Z" vector can enable bidirectional haptic/sound features once this sort of WorkCoils(s) assembly has been tested with permanent magnets on. In any case i was also counting on a "Z" axis to create a feedback signal actually reflecting how its associated susceptor happens to align between those 2 planes distributed on each PCBoard parallel side (if "2.5" version retained)...
Though moot enthousiasm for 1 cm thin extremes equally results in the obvious idea that now it's high power-density cells anyway which set slim casing thickness ultimately!
AWG#16 = 1.29 mm (dia.), 50~100 KHz
E.G. exactly 1.29032 mm diameter...
Estimated minimal PCBoard size:
6.7 cm x 6.4 cm
As thin as 1 cm if all U-cores have their central external corners cut to accomodate juxtaposed Coil units, e.g. if that's all intended to fit into only 1 same plane, hence implicitely sacrificing some benefits as a "trade-off", naturally...
In particular i was most optimistic that a 3rd axis presumed assimilable to some "pseudo-Z" vector can enable bidirectional haptic/sound features once this sort of WorkCoils(s) assembly has been tested with permanent magnets on. In any case i was also counting on a "Z" axis to create a feedback signal actually reflecting how its associated susceptor happens to align between those 2 planes distributed on each PCBoard parallel side (if "2.5" version retained)...
Though moot enthousiasm for 1 cm thin extremes equally results in the obvious idea that now it's high power-density cells anyway which set slim casing thickness ultimately!